Electrical assembly testing using robotic positioning of probes
US5469064A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 1993 |
| Grant date | Nov 21, 1995 |
| Priority date | — |
| Expiry date | Sep 15, 2013 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/3025
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention is an improved printed circuit board test system in which test probes are positioned to electronically engage a selected device or printed circuit board section on a printed circuit board for testing the printed circuit board for manufacturing defects. The printed circuit board test system uses a bed-of-nails test fixture to ground and excite predetermined sites on a first side of the printed circuit board and a robot to mechanically position test probe(s) at selected test sites on a second side of the printed circuit board. A controller is used to control the movement of the robotic tester and the selection of spring probes in the bed-of-nails fixture to be exited, grounded or measured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.