Patent · US Expired

Method of making field effect transistor

US5470767A · kind A · utility

11Cited by
6References
3Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 14, 1994
Grant dateNov 28, 1995
Priority date
Expiry dateOct 14, 2014

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D64/411
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A semiconductor device having a gate electrode having a leg with two mutually offset portions is formed by successively depositing on a semiconductor substrate an amorphous material and a crystalline metal layer. A portion of the crystalline metal layer is removed photolithographically and the amorphous material is etched to form a hole extending to the semiconductor substrate. The through hole is filled when a second amorphous material is deposited on the crystalline metal layer. A second hole is photolithographically prepared in the second amorphous material, partially aligned with the first hole and filled with a gate electrode material, and thereafter the second amorphous material, crystalline metal layer, and original amorphous material are removed, leaving a gate electrode having a leg with mutually offset portions.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.