Method for forming chip carrier with a single protective encapsulant
US5471027A · kind A · utility
94Cited by
5References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 22, 1994 |
| Grant date | Nov 28, 1995 |
| Priority date | — |
| Expiry date | Jul 22, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49171
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates generally to a new apparatus and method for a chip carrier. More particularly, the invention encompasses an apparatus and a method that uses a chip carrier having a single encapsulant to provide both flip chip fatigue life enhancement and environmental protection. A double-sided, pressure-sensitive, thermally-conductive adhesive tape could also be used with the encapsulated chip to directly attach the chip to a heat sink. Similarly, also disclosed is a method and apparatus for directly joining a heat sink to the chip carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.