Method of planarizing polycrystalline diamonds, planarized polycrystalline diamonds and products made therefrom
US5472370A · kind A · utility
26Cited by
11References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 1994 |
| Grant date | Dec 5, 1995 |
| Priority date | — |
| Expiry date | Jul 29, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed is a method of planarizing a diamond film which generally includes orifices in the surface. The method includes first polishing the diamond film surface to reduce the surface roughness. Next, a filler material is applied to the surface of the film to fill the orifices in the film. Finally, the film is polished to remove excess filler material and expose the diamond film surface. Also disclosed are planarized diamond films diamond substrate having a polished surface of both diamond and filler material and a variation in thickness of less than 8 percent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.