Method for controlling electromigration and electrically conductive interconnect structure therefor
US5472911A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 1994 |
| Grant date | Dec 5, 1995 |
| Priority date | — |
| Expiry date | Sep 2, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/927
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and an electrically conductive interconnect structure (30) for controlling electromigration. The electrically conductive interconnect structure (30) comprises a groove (33) adjacent an electrically conductive interconnect (39). The electrically conductive interconnect (39) is patterned from a deposited layer of conductive material which contains global grain microstructures. Moreover, the electrically conductive interconnect (39) is patterned to have polycrystalline and single-grain segment lengths that are less than a length at which an electromigration flux fails to overcome a gradient-driven counter flux in a line segment. The groove (33) controls the polycrystalline and single-grain segment lengths to be less than the critical length, thereby reducing electromigration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.