Michael Dreyer
7Patents
6h-index
17Co-inventors
60Inventor score
Filing activity: Jul 2, 1990 → Dec 6, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5049811A | Measuring integrity of semiconductor multi-layer metal structures | Physics | 24 | Expired |
| US5760476A | Interconnect run between a first point and a second point in a semiconductor device for reducing electromigration failure | Emerging Cross-Sectional Technologies | 18 | Expired |
| US7822679B1 | Method and system for conducting a commercial transaction between a buyer and a seller | Physics | 17 | Active |
| US5461260A | Semiconductor device interconnect layout structure for reducing premature electromigration failure due to high localized current density | Emerging Cross-Sectional Technologies | 15 | Expired |
| US10007915B2 | Systems and methods to facilitate loyalty reward transactions | Physics | 12 | Active |
| US5472911A | Method for controlling electromigration and electrically conductive interconnect structure therefor | Emerging Cross-Sectional Technologies | 7 | Expired |
| US10976344B1 | System and method for performing scanning tunneling microscopy on current-carrying samples | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.