Method of bonding copper and a substrate for power electronics and made of a non-oxide ceramic
US5473137A · kind A · utility
7Cited by
5References
6Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 25, 1993 |
| Grant date | Dec 5, 1995 |
| Priority date | — |
| Expiry date | Jun 25, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/381
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of bonding copper to a heat conducting and electrically insulating power electronics substrate made of a non-oxide ceramic selected from AlN, SiC, and BN, the method including the steps of oxidizing the surface of the substrate and then directly bonding copper to the oxidized surface of the substrate, wherein the step of oxidizing the surface of the substrate is performed by irradiating the surface using a laser beam to a thickness in the range 0.1 .mu.m to 3 .mu.m.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.