Alain Petitbon
11Patents
7h-index
17Co-inventors
59Inventor score
Filing activity: Oct 16, 1987 → Sep 5, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4814575A | Method of surface-treating ceramic workpieces using a laser | Performing Operations; Transporting | 78 | Expired |
| US6084771A | Power electronic module and power electronic device including such modules | Electricity | 43 | Expired |
| US6166903A | Electronic power module, and electronic power system comprising a plurality of said modules | Electricity | 20 | Expired |
| US5529858A | Hermetically sealed thermocompression feedthrough and peripheral seal for high temperature lithium based battery applications | Emerging Cross-Sectional Technologies | 19 | Expired |
| US5312804A | Method of fabricating a superconductive flexible ceramic conductor having a high critical temperature | Emerging Cross-Sectional Technologies | 19 | Expired |
| US6589859B2 | Method of manufacturing an electronic power component, and an electronic power component obtained thereby | Electricity | 11 | Expired |
| US5473137A | Method of bonding copper and a substrate for power electronics and made of a non-oxide ceramic | Electricity | 7 | Expired |
| US6297079A | Method of electrically connecting IGBT transistor chips mounted on an integrated-circuit wafer | Electricity | 6 | Expired |
| US6960278B2 | Method of improving the properties of adhesion of a non-oxide ceramic substrate before gluing it | Electricity | 5 | Expired |
| US6274451A | Method of fabricating a gate-control electrode for an IGBT transistor | Electricity | 2 | Expired |
| US6006979A | Method of bonding a diamond substrate to at least one metal substrate | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.