Hybrids semiconductor circuit
US5473187A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 1994 |
| Grant date | Dec 5, 1995 |
| Priority date | — |
| Expiry date | Sep 13, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A hybrid semiconductor device which comprises a semiconductor substrate having electrical devices therein with a plurality of spaced apart relatively rigid standoffs of electrically insulating material disposed over the substrate. Each of the standoffs has a substantially planar exposed surface remote from the substrate. A first layer of electrically insulating material more resilient than the standoffs is disposed over the substrate and between the standoffs and has an upper surface coplanar with the planar exposed surfaces of the standoffs. A semiconductor superstrate is secured to the first layer of electrically insulating material, the superstrate containing electrical devices. A connection connects the electrical devices contained in the superstrate to the electrical devices in the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.