Electronic device package having electronic device boonded, at a localized region thereof, to circuit board
US5473512A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 1994 |
| Grant date | Dec 5, 1995 |
| Priority date | — |
| Expiry date | Jun 16, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device, such as an integrated circuit chip or a multichip module, is held in place overlying a circuit board, with which it is thermal expansion mismatched, by three or more localized rigid support elements. The bottom surface of the chip is bonded to the top surface of preferably only one of these support elements and can laterally slide along the top surfaces of the others in response to heating and cooling during electrical operations of the electronic device. In addition, the electronic device is encapsulated in a soft gel that is held in place by a rigid plastic half-shell cover that is epoxy-bonded in place along its perimeter (edge).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.