Inventor · Seoul, KR

Byung Joon Han

72Patents
22h-index
60Co-inventors
91Inventor score

Filing activity: Jun 16, 1994 → Jul 1, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US5866939A Lead end grid array semiconductor package Electricity 296 Expired
US5608262A Packaging multi-chip modules without wire-bond interconnection Electricity 269 Expired
US5646828A Thin packaging of multi-chip modules with enhanced thermal/power management Electricity 223 Expired
US6861288B2 Stacked semiconductor packages and method for the fabrication thereof Electricity 159 Expired
US5473512A Electronic device package having electronic device boonded, at a localized region thereof, to circuit board Electricity 130 Expired
US6462274B1 Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages Electricity 78 Expired
US6150709A Grid array type lead frame having lead ends in different planes Electricity 76 Expired
US7372141B2 Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides Electricity 59 Expired
US7364945B2 Method of mounting an integrated circuit package in an encapsulant cavity Electricity 57 Expired
US7429787B2 Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides Electricity 54 Expired
US6414396B1 Package for stacked integrated circuits Electricity 54 Expired
US5858815A Semiconductor package and method for fabricating the same Electricity 52 Expired
US7309913B2 Stacked semiconductor packages Electricity 52 Expired
US7435619B2 Method of fabricating a 3-D package stacking system Electricity 40 Active
US5767447A Electronic device package enclosed by pliant medium laterally confined by a plastic rim member Electricity 38 Expired
US5834160A Method and apparatus for forming fine patterns on printed circuit board Electricity 37 Expired
US6642610B2 Wire bonding method and semiconductor package manufactured using the same Electricity 36 Expired
US8643163B2 Integrated circuit package-on-package stacking system and method of manufacture thereof Electricity 30 Active
US6020219A Method of packaging fragile devices with a gel medium confined by a rim member Electricity 27 Expired
US7733661B2 Chip carrier and fabrication method Emerging Cross-Sectional Technologies 26 Active
US6630373B2 Ground plane for exposed package Electricity 25 Expired
US8378476B2 Integrated circuit packaging system with stacking option and method of manufacture thereof Electricity 23 Active
US8309397B2 Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereof Electricity 22 Active
US5977624A Semiconductor package and assembly for fabricating the same Electricity 21 Expired
US6858470B1 Method for fabricating semiconductor packages, and leadframe assemblies for the fabrication thereof Electricity 19 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.