Method for hermetically sealing a single layer ceramic thick film electronic module
US5475567A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 20, 1993 |
| Grant date | Dec 12, 1995 |
| Priority date | — |
| Expiry date | Dec 20, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1394
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method is provided for hermetically sealing a surface-mounted thick film electronic module within a cover soldered to a ceramic substrate, under the circumstances in which the input/output terminals of the electronic module are electrically interconnected with their corresponding external conductors on the exterior of the cover with a number of conductors. The integrity of the hermetic seal is promoted by routing the conductors beneath the ceramic substrate, as opposed to printing the conductors directly on the surface of the ceramic substrate, which necessitates that a dielectric material be placed intermediate the conductors and the bond material so as to electrically isolate the conductors from the bond material and cover. Consequently, an advantage of the present invention is the avoidance of a material mismatch between the dielectric material and the bonding material and the cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.