Circuit board with metal layer for solder bonding and electronic circuit device employing the same
US5476726A · kind A · utility
26Cited by
14References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 19, 1993 |
| Grant date | Dec 19, 1995 |
| Priority date | — |
| Expiry date | Jan 19, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solder bonding metal layer which is formed on a circuit board comprises a metal layer having a mixture of first metal which is easily wetted with metals constituting the solder and which easily forms alloy or intermetallic compounds and of second metal which is not wetted easily with the above solder and not melted. In this case, a concentration gradient that the concentration of the first metal is high on the bonding surface may be formed in the metal layer. A circuit board having a solder bonding metal layer which keeps good bonding even after many times of repairs and improves the reliability is realized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.