Bump electrode for connecting electronic components
US5477087A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 1994 |
| Grant date | Dec 19, 1995 |
| Priority date | — |
| Expiry date | Nov 18, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to connecting electronic components using bump electrodes to connect electronic components such as semiconductors with the patterning electrodes of a circuit board. In order to prevent deterioration in connecting reliability due to deformation and the like of semiconductors and circuit boards, it is necessary to have some elasticity incorporated within bump electrodes. The bump electrodes disclosed by the present invention have resin bumps with numerous cavities disposed within and covered by a low melting point metal layer. According to this composition, even when there are some variations of distribution in circuit board warp and bump electrode height, it is possible to absorb the variations through the elasticity presented by the bump electrodes. It is also possible to perform a low strain connection with a resultant enhancement in connecting reliability at high temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.