Selective removal of a single solder ball from an array of solder balls
US5478009A · kind A · utility
11Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 10, 1994 |
| Grant date | Dec 26, 1995 |
| Priority date | — |
| Expiry date | Aug 10, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solder ball removal tool uses ultrasonic vibrations to remove specific solder balls from high density chips, substrate solder ball terminal connections, card or board solder ball connections, or other solder ball array for the purpose of customizing the electrical functionality of a module. The tool also allows for the removal of damaged or defective solder balls for the purpose of replacement with defect free solder balls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.