Process and apparatus for ashing treatment
US5478403A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 1994 |
| Grant date | Dec 26, 1995 |
| Priority date | — |
| Expiry date | Dec 27, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/46
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A process and apparatus for the ashing treatment in which a plasma generated by activating a gas containing at least oxygen is applied to a material to be treated, on which a coating film of an organic is formed, through a plasma-transmitting plate for capturing charged particles in the plasma and allowing the transmission of neutral active species, to thereby ash the coating film of the organic substance. The material to be treated is placed at a position at which charged particles of a high energy, which have been transmitted through the plasma-transmitting plate without being captured by the plasma-transmitting plate, impinge thereon together with the neutral active species which have been transmitted through the plasma-transmitting plate. Also, the ashing treatment process and apparatus includes a distance-adjusting device for adjusting the distance between the plasma-transmitting plate and the material to be treated, by changing the position of the material to be treated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.