Real time control of plasma etch utilizing multivariate statistical analysis
US5479340A · kind A · utility
98Cited by
4References
10Claims
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Key dates
| Filing date | Sep 20, 1993 |
| Grant date | Dec 26, 1995 |
| Priority date | — |
| Expiry date | Sep 20, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/334
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Hotelling's T.sup.2 statistical analysis and control is used to provide multivariate analysis of components of an RF spectra for real time, in-situ control of an ongoing semiconductor process. An algorithm calculates the T.sup.2 value which is then used to generate a feedback signal, if the T.sup.2 value is out of range, to indicate an out-of-tolerance condition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.