Method for removing copper oxide on the surface of a copper film and a method for patterning a copper film
US5482174A · kind A · utility
17Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 3, 1994 |
| Grant date | Jan 9, 1996 |
| Priority date | — |
| Expiry date | Jun 3, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1157
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for removing copper oxide on a surface of a copper film is comprising the steps of treating the surface of the copper film with acid, neutralizing the surface of the copper film treated with acid, and washing the neutralized surface of the copper film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.