High density semiconductor package
US5483024A · kind A · utility
84Cited by
10References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 8, 1993 |
| Grant date | Jan 9, 1996 |
| Priority date | — |
| Expiry date | Oct 8, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention discloses a high density semiconductor package. In one embodiment, two semiconductor chips are each affixed on a corresponding one of two lead frames. The semiconductor chips and the lead frames are encapsulated, wherein only a portion of the leads of the lead frames protrudes and extends from the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.