Patent · US Expired

Piezoresistive silicon pressure sensor implementing long diaphragms with large aspect ratios

US5485753A · kind A · utility

97Cited by
5References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 28, 1993
Grant dateJan 23, 1996
Priority date
Expiry dateOct 28, 2013

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49103
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A form of pressure sensor diaphragm and method of making that allows for the formation of long rectangular plate structures in semiconducting material, especially Silicon. A plurality or multiplicity of sensors may be constructed on a single chip, thus providing for absolute and relative sensing of pressure on a single device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.