Max C. Glenn
25Patents
11h-index
23Co-inventors
75Inventor score
Filing activity: Apr 8, 1985 → Jul 31, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5485753A | Piezoresistive silicon pressure sensor implementing long diaphragms with large aspect ratios | Emerging Cross-Sectional Technologies | 97 | Expired |
| US4855544A | Multiple level miniature electromechanical accelerometer switch | Physics | 67 | Expired |
| US4891985A | Force sensor with attached mass | Physics | 59 | Expired |
| US6978673B2 | Methods and systems for simultaneously fabricating multi-frequency MEMS devices | Physics | 37 | Expired |
| US4763098A | Flip-chip pressure transducer | Emerging Cross-Sectional Technologies | 34 | Expired |
| US5714690A | Piezoresistive silicon pressure sensor manufacture implementing long diaphragms with large aspect ratios | Emerging Cross-Sectional Technologies | 33 | Expired |
| US4665754A | Pressure transducer | Emerging Cross-Sectional Technologies | 32 | Expired |
| US6782748B2 | High-G acceleration protection by caging | Physics | 17 | Expired |
| US6041659A | Methods and apparatus for sensing differential and gauge static pressure in a fluid flow line | Physics | 15 | Expired |
| US7074636B2 | Methods and apparatus for attaching getters to MEMS device housings | Electricity | 14 | Expired |
| US6865944B2 | Methods and systems for decelerating proof mass movements within MEMS structures | Performing Operations; Transporting | 13 | Expired |
| US6544655B1 | Methods for reducing the curvature in boron-doped silicon micromachined structures | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6914323B2 | Methods and apparatus for attaching getters to MEMS device housings | Electricity | 7 | Expired |
| US8011247B2 | Multistage proof-mass movement deceleration within MEMS structures | Performing Operations; Transporting | 6 | Active |
| US6987304B2 | Methods and apparatus for particle reduction in MEMS devices | Physics | 5 | Expired |
| US6927098B2 | Methods and apparatus for attaching MEMS devices to housing | Electricity | 4 | Expired |
| US7037805B2 | Methods and apparatus for attaching a die to a substrate | Electricity | 4 | Expired |
| US7314777B2 | Chip packaging systems and methods | Emerging Cross-Sectional Technologies | 2 | Expired |
| US7977786B2 | Saw debris reduction in MEMS devices | Performing Operations; Transporting | 2 | Active |
| US6969425B2 | Methods for reducing the curvature in boron-doped silicon micromachined structures | Emerging Cross-Sectional Technologies | 2 | Expired |
| US8614491B2 | Package interface plate for package isolation structures | Performing Operations; Transporting | 1 | Active |
| US7297573B2 | Methods and apparatus for particle reduction in MEMS devices | Physics | 1 | Expired |
| US6946200B2 | Methods for reducing the curvature in boron-doped silicon micromachined structures | Emerging Cross-Sectional Technologies | 1 | Expired |
| US9476712B2 | MEMS device mechanism enhancement for robust operation through severe shock and acceleration | Emerging Cross-Sectional Technologies | 0 | Active |
| US7800190B2 | Getter on die in an upper sense plate designed system | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.