Electroplating method and apparatus
US5486272A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 1994 |
| Grant date | Jan 23, 1996 |
| Priority date | — |
| Expiry date | May 31, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25C7/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of removing metal from a feedstock solution containing dissolved metal ions which comprises passing the feedstock through an annular gap, the inner surface of which is cathodic to the metal ion and the outer surface of which is anodic in such a way that the flow is turbulent. Also claimed is an apparatus for removing metal from a feedstock which comprises a reactor afforded by an inner cathode tube, and an outer anode tube spaced therefrom by a narrow annular gap, direct electric current supply means to the anode and cathode, pump means for pumping feedstock into the said annular gap at high flow rates, a holding tank, pipe work connecting the holding tank to the said pump means and the pipe work connecting the end of the annular gap remote from the pump to the holding tank.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.