Electronic package having active means to maintain its operating temperature constant
US5491610A · kind A · utility
86Cited by
1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 1994 |
| Grant date | Feb 13, 1996 |
| Priority date | — |
| Expiry date | Sep 9, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An electronic package having an active cooling system for maintaining a semiconductor chip at approximately a constant temperature by monitoring the present temperature of the chip and varying the air flow over a heat sink in thermal contact with the chip in response to the temperature. In addition, the temperature difference between the semiconductor chip module and a printed circuit board is also monitored to maintain that difference at a preset value. The air flow is varied by a variable speed fan or a variable direction baffle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.