Method for fabricating encased molded multi-chip module substrate
US5492586A · kind A · utility
30Cited by
8References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 24, 1994 |
| Grant date | Feb 20, 1996 |
| Priority date | — |
| Expiry date | Jun 24, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating a multi-chip module substrate comprises providing a carrier having a well. Substrate molding material is poured into the carrier well. A plurality of chips is situated in the substrate molding material. A laminatable dielectric layer is laminated over the substrate molding material at a predetermined temperature and a predetermined pressure so that the substrate molding material flows and encapsulates the chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.