Apparatus and method for creating detachable solder connections
US5494856A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 1994 |
| Grant date | Feb 27, 1996 |
| Priority date | — |
| Expiry date | Oct 18, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method is provided for creating solder connections between two surfaces which connections are relatively weak and thus can be readily fractured for separating the surfaces. The preferred application of the disclosed process is its use in connecting semiconductor chips to a carrier in order to conduct burn-in tests on the chips. The process consists of a series of steps to form a surface having a matrix of solder wettable and solder non-wettable areas on the pads of the carrier. Once the solder balls on the chip are attached to the treated pads on the carrier, electrical contacts are made and the chip can be readily removed after the test. The uniquely configured carrier can then be reused numerous times for testing or burning-in chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.