Guy D. Beaumont
6Patents
5h-index
7Co-inventors
48Inventor score
Filing activity: Oct 18, 1994 → Nov 1, 1999
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6003757A | Apparatus for transferring solder bumps and method of using | Electricity | 36 | Expired |
| US5494856A | Apparatus and method for creating detachable solder connections | Emerging Cross-Sectional Technologies | 13 | Expired |
| US5574386A | Apparatus and method for creating detachable solder connections | Emerging Cross-Sectional Technologies | 9 | Expired |
| US5920114A | Leadframe having resilient carrier positioning means | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6277442A | Closed chamber method and apparatus for the coating of liquid films | Physics | 6 | Expired |
| US6351883B1 | Self align leadframe having resilient carrier positioning means | Emerging Cross-Sectional Technologies | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.