Particle contamination apparatus for semiconductor wafer processing
US5496409A · kind A · utility
1Cited by
9References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 18, 1994 |
| Grant date | Mar 5, 1996 |
| Priority date | — |
| Expiry date | Jul 18, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/4412
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A semiconductor wafer processing system is disclosed which reduces particle accumulations in the wafer loading chamber during the pump down and vent cycle. A separate venting tube is provided which is positioned within the roughing tube used for the pump-down cycle. The venting tube is isolated from particulate matter which may be present in the roughing tube so that venting gas flow does not cause re-entry of the residual particulate matter into the loading chamber. The venting tube can be easily and inexpensively installed as a particle reduction kit into existing wafer processing systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.