Patent · US Expired

Method of manufacturing film carrier type substrate

US5496772A · kind A · utility

2Cited by
1References
2Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 4, 1992
Grant dateMar 5, 1996
Priority date
Expiry dateJun 4, 2012

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2201/2063
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A film carrier type substrate includes a film made of organic high molecular substance, a metal layer formed over the film by depositing metal vapor and irradiating nitrogen gas ions on the film and a mixing layer made of a mixture of the materials of both the metal layer and the film formed in the interface between the metal layer and the film. Prior to forming the metal layer, inert gas ions and/or nitrogen gas ions may be irradiated on the film in advance.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.