Multi-layer semiconductor package substrate with thermally-conductive prepeg layer
US5500555A · kind A · utility
20Cited by
5References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 11, 1994 |
| Grant date | Mar 19, 1996 |
| Priority date | — |
| Expiry date | Apr 11, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Improved thermal characteristics are obtained in a multi-layer substrate for mounting a semiconductor device. A prepeg layer disposed in close proximity to or immediately adjacent to a semiconductor device is formed incorporating an integral, thermally-conductive mesh or screen. The prepeg layer is preferably a sandwich structure of two BT-resin layers (films), between which is disposed a copper screen. In this manner, heat is conducted away from an operating device by an integral part of the substrate, without the need for additional slugs or heat sink structures. Utility for multichip modules is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.