Vertically mounted accelerometer chip
US5503016A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 1, 1994 |
| Grant date | Apr 2, 1996 |
| Priority date | — |
| Expiry date | Feb 1, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48247
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Micro-machined accelerometer chips have a sensitive axis perpendicular to the principle surface of the device. In an application where the desired sensing direction is in the plane of a supporting printed circuit board, the accelerometer cannot be mounted directly on the printed circuit board and instead is mounted on a wall perpendicular to the printed circuit board. This requirement to wall-mount the sensor is eliminated by using an accelerometer chip packaged with a signal conditioning circuit in a multi layer ceramic chip carrier. Electrical connections are contained within the layers of the ceramic and terminate at a side surface of the chip carrier. Thus the accelerometer chip sits perpendicular to the printed circuit board and the ceramic chip carrier is attached directly thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.