Adhesively sealed metal electronic package incorporating a multi-chip module
US5504372A · kind A · utility
22Cited by
35References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 1994 |
| Grant date | Apr 2, 1996 |
| Priority date | — |
| Expiry date | Dec 12, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a leadframe assembly for supporting a hybrid circuit. The hybrid circuit is supported by either the base of an electronic package or by a die attach paddle and electrically interconnected to a leadframe by wire bonds. A plurality of semiconductor devices are mounted on the assembly and supported by either metallization pads formed on the hybrid circuit, a dielectric layer of the hybrid circuit, a die attach paddle, a metallic package component or combinations thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.