Electronic package having improved wire bonding capability
US5506446A · kind A · utility
49Cited by
24References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 25, 1995 |
| Grant date | Apr 9, 1996 |
| Priority date | — |
| Expiry date | May 25, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a base for an electronic package. The base includes a peripheral portion for a polymer adhesive and a central portion for one or more semiconductor devices. A lead support is adjacent the substrate and located between the peripheral portion and the central portion. When a polymer adhesive bonds a leadframe to the package base, the lead support prevents deflection of the inner lead tips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.