Contact sensor-based microdispensing tool

US5507872A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Annette B. Antenucci · Pittsburgh, US
• Michael Berger · Sharon, US
• Judy E. Lambert · Austin, US
• David T. Naugle · Poughkeepsie, US
• Stephen A. O. Olson · Palo Alto, US
• Jae Man Park · Seoul, KR
• Thomas Rednour · Beacon, US
• Benoit Ventimiglia · Poughkeepsie, US
• Richard J. Weckesser · Rhinebeck, US

Key dates

• Filing date: Nov 22, 1994
• Grant date: Apr 16, 1996
• Expiry date: Nov 22, 2014

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T156/1798
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A contact-based microdispensing tool for delivering extremely minute globules of epoxy material to repaired sites on high circuit density modules. The tool includes a solid probe integrally mounted in a contact sensor assembly incorporating an air-levitated core of a linear voltage differential transducer. The levitated core and the probe connected thereto are supported in neutral equilibrium by an air bearing assembly. As the assembly probe is brought into contact with one of the sites, the globule flows upon the site, the equilibrium is disturbed and a signal is produced by the transducer to halt movement of the probe relative to the site.