Autodeposition emulsion and methods of using thereof to selectively protect metallic surfaces
US5508141A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 1994 |
| Grant date | Apr 16, 1996 |
| Priority date | — |
| Expiry date | Dec 2, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0796
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A coating of resin and photoactive functionality is autodeposited from an emulsion onto a metallic substrate in order to selectively protect the substrate from corrosive environments such as etchant processes. An acid and oxidizing agent are included in the emulsion so that when the substrate is immersed in the emulsion the resin and photoactive functionality autodeposits. The resulting coating can be exposed to actinic radiation in an image-wise fashion and developed in an alkaline solution to develop the image created. In instances where the emulsion and process are used to make circuit boards, the metallic surface uncovered during developing is then etched away, leaving only the coated sections of the surface. The resulting coated surfaces will be the circuit traces of the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.