SOI DRAM with field-shield isolation and body contact
US5508219A · kind A · utility
96Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 1995 |
| Grant date | Apr 16, 1996 |
| Priority date | — |
| Expiry date | Jun 5, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/201
Abstract
An SOI deep-trench DRAM having body contacts and field shield isolation makes contact between the SOI device layer and the field shield layer at selected sites between adjacent deep trench capacitors. The field shield layer is biased negative to provide better isolation and to set the body potential of the array transistors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.