Method of making substrate edge connector
US5509197A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 10, 1994 |
| Grant date | Apr 23, 1996 |
| Priority date | — |
| Expiry date | Jun 10, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49208
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method is provided for attaching components to a substrate to form an edge connector thereon. In particular, the invention is useful for attaching an edge connector to a printed circuit board. The connector components are provided in a form that can be mounted on one side of a substrate, such as in a pick-and-place operation. The connector components may include pins for male connectors or sockets for female connectors. The pins or sockets of the connector are removably coupled to a carrier, forming a carrier assembly. The carrier assembly is configured to operably engage a carrier support that is integrally formed with the printed circuit board substrate. After the connector components are fastened, as by soldering, to the printed circuit board, the carrier and carrier support can be removed to leave the connector attached to the printed circuit board. A panelization technique is also provided that permits both sides of two-sided printed circuit boards to be populated using the same equipment and procedures tier both sides of a symmetrical panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.