Method for forming a thin film transistor
US5510278A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 6, 1994 |
| Grant date | Apr 23, 1996 |
| Priority date | — |
| Expiry date | Sep 6, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S148/109
Abstract
An under-gated thin film transistor (54) having low leakage current and a high on/off current ratio is formed using a composite layer (40) of semiconducting material. In one embodiment a composite layer (40) of semiconducting layer is formed by depositing two distinct layers (34, 38) of semiconducting material over the transistor gate electrode (18). The composite layer (40) is then patterned and implanted with ions to form a source region (46) and a drain region (48) within the composite layer (40), and to define a channel region (50) and an offset drain region (52) within the composite layer (40).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.