Patent · US Expired

Method for forming a thin film transistor

US5510278A · kind A · utility

51Cited by
13References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 6, 1994
Grant dateApr 23, 1996
Priority date
Expiry dateSep 6, 2014

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S148/109

Abstract

An under-gated thin film transistor (54) having low leakage current and a high on/off current ratio is formed using a composite layer (40) of semiconducting material. In one embodiment a composite layer (40) of semiconducting layer is formed by depositing two distinct layers (34, 38) of semiconducting material over the transistor gate electrode (18). The composite layer (40) is then patterned and implanted with ions to form a source region (46) and a drain region (48) within the composite layer (40), and to define a channel region (50) and an offset drain region (52) within the composite layer (40).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.