Method and adjustment for known good die testing using resilient conductive straps
US5510721A · kind A · utility
19Cited by
8References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 1994 |
| Grant date | Apr 23, 1996 |
| Priority date | — |
| Expiry date | Dec 19, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0483
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test apparatus for testing a know-good die integrated circuit is disclosed. The test apparatus uses conductive straps extending across trenches. The straps align with bond pads on the integrated circuit. When the bond pads are brought into contact with the straps, the straps exert a counterforce in the opposite direction to ensure a good electrical contact while testing the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.