Optical device heat spreader and thermal isolation apparatus
US5513073A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 1994 |
| Grant date | Apr 30, 1996 |
| Priority date | — |
| Expiry date | Apr 28, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4274
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Attachment of electronics to optical devices is made by supporting the optical devices on a heat spreader card and the electronics on a separate circuit card. Each card has at least a first major surface, with an optical transducing subassembly mounted perpendicularly from the major surface of the heat spreader card. Electronics, except for transducing elements, are placed on the circuit card. The only direct attachment between the circuit card and the heat spreader card is one or more flexible cables attached to the respective major surfaces. This arrangement mechanically isolates the circuit card from the heat spreader card. The flexible cables include electrical conductors held positionally in a polyimide matrix, which provides for thermal isolation of the heat spreader card and the circuit card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.