Thermoelectric module having reduced spacing between semiconductor elements
US5515238A · kind A · utility
Inventors
Key dates
| Filing date | Feb 28, 1995 |
| Grant date | May 7, 1996 |
| Priority date | — |
| Expiry date | Feb 28, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/93
Abstract
An improved thermoelectric module is described. A first electrically conductive pattern is defined on a first substrate and a second electrically conductive pattern is defined on a second substrate. Alternating bars of a first thermoelectric material and a second thermoelectric material are arranged parallel to each other. The bars are fixed into place on the first conductive pattern by an effective thermal and electrical connection with the conductive pattern. One such connection means is soldering. Then the bars are separated into elements. The second substrate is positioned over the elements and fixed to the elements to complete the manufacture of the TEM.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.