Molded carrier ring leadframe having a particular resin injecting area design for gate removal and semiconductor device employing the same
US5517056A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1993 |
| Grant date | May 14, 1996 |
| Priority date | — |
| Expiry date | Sep 30, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadframe (30) having a novel resin injecting area (44) is disclosed to facilitate and control the removal of a molded gate (18) prior to excising a semiconductor device(70) from a carrier ring (14). The carrier ring has a corner which is on a diagonal with a corner of the package body (12) to form the resin injecting area. The resin injecting area of the leadframe has a hole (48) and an extension bar (50) extending from the hole to connect to a tie bar (36), which supports a die pad (32), inside the package body. The hole in the leadframe is designed for retaining a molded gate. The extension bar is designed to make the removal of a portion of a molded gate easier and more controllable. The semiconductor device can be shipped in the carrier ring with a portion of the molded gate already removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.