Multichip module with integrated test circuitry disposed within interposer substrate

US5517515A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Edward J. Spall · Manassas, US
• Thomas M. Storey · Manassas, US

Key dates

• Filing date: Aug 17, 1994
• Grant date: May 14, 1996
• Expiry date: Aug 17, 2014

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/318505
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A multichip module (MCM) and associated fabrication technique are presented wherein a test circuit is disposed within the interposer substrate of the MCM to facilitate testing of the module's integrated circuit chips and testing of the interconnect wiring between integrated circuit chips. The test circuitry, disposed within the interposer substrate comprises semiconductor logic circuitry that electrically connects to the integrated circuit chips of the module. In the various multiplexer latch and shift register latch embodiments disclosed, active test circuitry within the interposer substrate is minimized and is essentially transparent to the integrated circuit chip designs incorporated in the MCM.