Fabrication processes for monolithic electronic modules
US5517754A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 1994 |
| Grant date | May 21, 1996 |
| Priority date | — |
| Expiry date | Jun 2, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1481
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention comprises various high production methods for simultaneously forming surface metallizations on a plurality of monolithic electronic modules. Each monolithic electronic module may comprise a single semiconductor chip or multiple semiconductor chips. The methods can employ a workpiece which automatically discontinues side surface metallization between different electronic modules in the stack. Multiple workpieces are interleaved within the stack between the electronic modules. Each workpiece may include a transfer layer(s) for permanent bonding to an end surface of an adjacent electronic module in the stack. This transfer layer may comprise an insulation layer, a metallization layer, an active circuit layer, or any combination thereof. End surface metallization can thus be provided contemporaneous with side surface metallization of multiple electronic modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.