Inventor · Williston, VT, US

Wayne J. Howell

67Patents
34h-index
64Co-inventors
91Inventor score

Filing activity: Sep 13, 1993 → Aug 24, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US5977640A Highly integrated chip-on-chip packaging Electricity 397 Expired
US5502333A Semiconductor stack structures and fabrication/sparing methods utilizing programmable spare circuit Electricity 263 Expired
US5561622A Integrated memory cube structure Electricity 198 Expired
US5502667A Integrated multichip memory module structure Electricity 195 Expired
US6358627B2 Rolling ball connector Emerging Cross-Sectional Technologies 149 Expired
US5691248A Methods for precise definition of integrated circuit chip edges Emerging Cross-Sectional Technologies 147 Expired
US5702984A Integrated mulitchip memory module, structure and fabrication Electricity 145 Expired
US5563086A Integrated memory cube, structure and fabrication Electricity 135 Expired
US5571754A Method of fabrication of endcap chip with conductive, monolithic L-connect for multichip stack Electricity 129 Expired
US5926029A Ultra fine probe contacts Physics 114 Expired
US6265771A Dual chip with heat sink Electricity 113 Expired
US5567654A Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging Electricity 107 Expired
US5478781A Polyimide-insulated cube package of stacked semiconductor device chips Electricity 105 Expired
US5466634A Electronic modules with interconnected surface metallization layers and fabrication methods therefore Electricity 103 Expired
US6410431B1 Through-chip conductors for low inductance chip-to-chip integration and off-chip connections Electricity 98 Expired
US5648684A Endcap chip with conductive, monolithic L-connect for multichip stack Electricity 94 Expired
US5786628A Method and workpiece for connecting a thin layer to a monolithic electronic modules surface and associated module packaging Electricity 83 Expired
US6294406A Highly integrated chip-on-chip packaging Electricity 80 Expired
US5907178A Multi-view imaging apparatus Electricity 77 Expired
US5517754A Fabrication processes for monolithic electronic modules Emerging Cross-Sectional Technologies 74 Expired
US5946545A Semiconductor stack structures and fabrication/sparing methods utilizing programmable spare circuit Electricity 66 Expired
US6271102A Method and system for dicing wafers, and semiconductor structures incorporating the products thereof Emerging Cross-Sectional Technologies 63 Expired
US5869896A Packaged electronic module and integral sensor array Electricity 60 Expired
US5719438A Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging Electricity 60 Expired
US5811868A Integrated high-performance decoupling capacitor Electricity 56 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.