Method of forming metal layers formed as a composite of sub-layers using Ti texture control layer
US5523259A · kind A · utility
42Cited by
14References
24Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 5, 1994 |
| Grant date | Jun 4, 1996 |
| Priority date | — |
| Expiry date | Dec 5, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an integrated circuit, an opening (e.g., via or window) is filled with an Al-based plug which has essentially a <111> orientation and comprises at most three grains. These characteristics are achieved by first depositing a texture control Ti layer having substantially a (002) basal plane orientation followed by at least three Al-based sublayers. The grain sizes and deposition conditions are controlled in such a way that during deposition of the third sublayer, the microstructure of the plug adjusts itself to produce a single grain (or at most three).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.