Rapid thermal annealing using thermally conductive overcoat
US5523262A · kind A · utility
30Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 1994 |
| Grant date | Jun 4, 1996 |
| Priority date | — |
| Expiry date | Jan 14, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus and method for improved heating uniformity during rapid thermal annealing through the use of a sacrificial layer covering the surface to be annealed. The composition and thickness of the layer are chosen to be opaque at the frequencies emitted by a radiant energy source, usually a xenon arc lamp, and also to be thermally conductive. The sacrificial layer absorbs the radiant energy and conducts the resulting heat to the surface to be annealed. After the annealing is complete, the sacrificial layer is etched away or left as an overcoat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.