Plastic encapsulated microelectronic device
US5523629A · kind A · utility
3Cited by
10References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 1994 |
| Grant date | Jun 4, 1996 |
| Priority date | — |
| Expiry date | Jul 21, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An encapsulated microelectronic device (100 ) including a base (101) and a semiconductor device (305) having a top and a bottom. The bottom is attached to the base (101). The semiconductor device (105) has a thickness in the range from one-fourth to three-fourths of a millimeter and has a bottom metallization consisting of aluminum (407)/chromium (405)/nickel (403)/gold (401). The semiconductor device (305) has a contact (115) attached to the top. The encapsulated microelectronic device (100) has a molded top (120) surrounding the semiconductor device (305 ). The molded top (120) is made from low stress molding material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.