Process for coated bonding wires in high lead count packages
US5527742A · kind A · utility
20Cited by
9References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 1995 |
| Grant date | Jun 18, 1996 |
| Priority date | — |
| Expiry date | Jun 28, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A transfer molded high lead count plastic semiconductor package is described. The packaged IC chip is mounted upon a suitable leadframe and the bonding pads wire bonded to the leadframe fingers. To avoid wire shorting, due to wire sweep during transfer molding, the wires are first coated with an insulative material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.