Flexible tab semiconductor device
US5528077A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 6, 1995 |
| Grant date | Jun 18, 1996 |
| Priority date | — |
| Expiry date | Mar 6, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A TAB semiconductor device according to the present invention is as follows. One end of each lead whose direction is fixed by a TAB tape is connected to a corresponding electrode on a semiconductor pellet placed at a predetermined position of the TAB tape. The TAB tape is a tape having the thin leads fixed on a film and a portion where the film is removed, i.e., a window portion in a predetermined area. Only the arrangement of the leads is exposed to the window portion. A user arbitrarily cuts the leads in this area in accordance with mounting. The leads have normal signal leads and wider leads together. As for these wider leads, slits are provided to make the lead widths uniform throughout the window portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.