Method of making subsurface electronic circuits
US5531020A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 1993 |
| Grant date | Jul 2, 1996 |
| Priority date | — |
| Expiry date | Aug 27, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of making a planar, subsurface electronic circuit having at least one electronic circuit component assembled therewith is disclosed. First, three dimensional, essentially square channels interspersed with lands are formed within a dielectric material on a substrate. The channels are then filled in one pass with a curable polymeric material containing a conductive metal filler so that the upper surfaces of the circuit trace formed by this conductive material are at essentially the same level as the upper surface of the lands. Circuit components are place to engage the conductive material. The curable material is then cured after placing the electronic component(s).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.